References

Abhari, R. and G.V. Eleftheriades, 2002. Suppression of the parallel-plate noise in high-speed circuits using a metallic electromagnetic band-gap structure. Proceedings of the International Symposium on Microwave Digest 2002 IEEE MTT-S, June 2-7, 2002, IEEE, New York, USA., ISBN: 0-7803-7239-5, pp: 493-496.

Abhari, R. and G.V. Eleftheriades, 2003. Metallo-dielectric electromagnetic bandgap structures for suppression and isolation of the parallel-plate noise in high-speed circuits. IEEE. Trans. Microwave Theory Tech., 51: 1629-1639.
CrossRef  |  Direct Link  |  

Chen, G. and K.L. Melde, 2006. Cavity resonance suppression in power delivery systems using electromagnetic band gap structures. IEEE. Trans. Adv. Packag., 29: 21-30.
CrossRef  |  Direct Link  |  

Hubing, T.H., J.L. Drewniak, T.P.V. Doren and D.M. Hockanson, 1995. Power bus decoupling on multilayer printed circuit boards. IEEE. Trans. Electromagn. Compat., 37: 155-166.
CrossRef  |  Direct Link  |  

Iglesias, E.R., L.I. Sanchez, J.L.V. Roy and E.G. Munoz, 2007. Size reduction of mushroom-type EBG surfaces by using edge-located vias. IEEE. Microwave Wirel. Compon. Lett., 17: 670-672.
CrossRef  |  Direct Link  |  

Kamgaing, T. and O.M. Ramahi, 2003. A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface. IEEE. Microwave Wirel. Compon. Lett., 13: 21-23.
CrossRef  |  Direct Link  |  

Kim, D., J. Yeo and J. Choi, 2008. Compact spatial triple-band-stop filter for cellular-PCS-IMT-2000 systems. ETRI. J., 30: 735-737.
Direct Link  |  

Lee, J., H. Kim and J. Kim, 2005. High dielectric constant thin film EBG power-ground network for broad-band suppression of SSN and radiated emissions. IEEE. Microwave Wirel. Compon. Lett., 15: 505-507.
CrossRef  |  Direct Link  |  

Lei, G.T., R.W. Techentin and B.K. Gilbert, 1999. High-frequency characterization of power-ground-plane structures. IEEE. Trans. Microwave Theory Tech., 47: 562-569.
CrossRef  |  Direct Link  |  

Shahparnia, S. and O.M. Ramahi, 2004. Electromagnetic interference (EMI) reduction from printed circuit boards (PCB) using electromagnetic bandgap structures. IEEE. Trans. Electromagn. Compat., 46: 580-587.
CrossRef  |  Direct Link  |  

Sievenpiper, D.F., 1999. High-impedance electromagnetic surfaces. Ph.D Thesis, Department Electric Engeering, University of California, Los Angeles, California.

Swaminathan, M., J. Kim, I. Novak and J.P. Libous, 2004. Power distribution networks for system-on-package: Status and challenges. IEEE. Trans. Adv. Packag., 27: 286-300.
CrossRef  |  Direct Link  |  

Wu, T.L., C.C. Wang, Y.H. Lin, T.K. Wang and G. Chang, 2005. A novel power plane with super-wideband elimination of ground bounce noise on high speed circuits. IEEE. Microwave Wirel. Compon. Lett., 15: 174-176.
CrossRef  |  Direct Link  |  

Wu, T.L., H.H. Chuang and T.K. Wang, 2010. Overview of power integrity solutions on package and PCB: Decoupling and EBG isolation. IEEE. Trans. Electromagn. Compat., 52: 346-356.
CrossRef  |  Direct Link  |  

Wu, T.L., S.T. Chen, J.N. Hwang and Y.H. Lin, 2004. Numerical and experimental investigation of radiation caused by the switching noise on the partitioned DC reference planes of high speed digital PCB. IEEE. Trans. Electromagn. Compat., 46: 33-45.
CrossRef  |  Direct Link  |  

Wu, T.L., Y.H. Lin and S.T. Chen, 2004. A novel power planes with low radiation and broadband suppression of ground bounce noise using photonic bandgap structures. IEEE. Microwave Wirel. Compon. Lett., 14: 337-339.
CrossRef  |  Direct Link  |